QUICK NK2280 Hot Air Nozzle
Code: QK-NK2280
Product detailed description
QUICK NK2280 Hot Air Nozzle
Square BGA nozzle 24×24 mm is shaped to surround the entire BGA package and evenly heat all balls at once. The target BGA chip with 24×24 mm body – typically SDRAM memory, graphics BGAs or network controllers – is desoldered simultaneously, minimizing the risk of cold BGA joints or chip shifting during rework. The shaped NK nozzle encloses the leads of the selected IC package from all four sides and provides even heating of leads for clean single-motion desoldering.
Compatibility
QUICK hot air stations TR1300, 855PG (NK series, IC-shaped)