Hot Air Nozzles
Product sorting
List of products
Round QUICK NK2064 hot air nozzle 6.4 mm for SOIC-8 and lead groups.
Round QUICK NK2084 hot air nozzle 8.4 mm for SOIC-16 and larger SMD ICs.
QUICK NK850 adapter for older NK nozzles on newer hot air handles.
Round QUICK NK1120 hot air nozzle 4 mm. Spot heating of SMD components.
Ultra-precise round QUICK NK1124 nozzle 2.5 mm for fine-pitch spot heating.
Round QUICK NK1130 hot air nozzle 4.4 mm for SOT-23 and small SMD transistors.
Round QUICK A1121 hot air nozzle with 6.4 mm diameter for SMD desoldering.
Large round QUICK A1301 hot air nozzle 12.7 mm for through-hole and large SMD.
Square QUICK A1125 hot air nozzle 10×10 mm for SOIC-8, SOT-23 and small SMD ICs.
Shaped QUICK NK3126 QFP nozzle 14×14 mm for LQFP-48 and TQFP-44 MCUs.
Square QUICK A1182 hot air nozzle 24×24 mm for QFP-44, PLCC-28 and mid-size ICs.
Shaped QUICK NK3127 QFP nozzle 17.5×17.5 mm for LQFP-64 with 0.5 mm pitch.
Rectangular QUICK NK3134 SOP nozzle 7.5×19 mm for SOIC-16 and SOP-20 narrow.
BQFP nozzle QUICK NK3180 17×17 mm for BQFP packages with protection bumpers.
BQFP nozzle QUICK NK3182 24×24 mm for larger BQFP-160 and BQFP-208.
SOJ nozzle QUICK NK3184 18×8 mm for SOJ memories (DRAM, SRAM) 300mil.
TSOJ nozzle QUICK NK3186 18×10 mm for TSOJ memories with extended body.
QUICK A1191 hot air nozzle 25L (L-shaped) for PLCC-44 and J-lead packages.
Shaped QUICK NK3129 QFP nozzle 28×28 mm for LQFP-100/128 and large FPGAs.
Smaller PLCC nozzle QUICK NK3140 11.5×11.5 mm for PLCC-20 and PLCC-28.
SIP nozzle QUICK NK3191 25L for SIP packages with single J-lead row.
Rectangular QUICK A1258 hot air nozzle 7.6×12.7 mm for SOP-8 and SO-16 ICs.
Special QFP nozzle QUICK NK3132 for non-standard package size.
SOJ nozzle QUICK NK3214 10×26 mm for long SOJ EDO DRAM and FPM DRAM.
SOP nozzle QUICK NK3257 11×21 mm for SOIC-20 wide-body and SOP-24.
Compact QUICK NK3258 nozzle 7.6×12.7 mm for narrow-body SOIC-8 and SO-8.
SOIC nozzle QUICK NK3259 13×28 mm for 28-lead SOIC and SOP wide-body.
SOIC nozzle QUICK NK3260 8.6×18 mm for 16-lead SOIC-16 (narrow body).
QFP nozzle QUICK NK3261 20×20 mm for LQFP-80 and QFP-80 ARM MCUs.
Small QFP nozzle QUICK NK3262 12×12 mm for LQFP-32 and compact TQFP-44.
BGA QUICK NK2280 hot air nozzle 24×24 mm for desoldering 24×24 mm BGA chips.
PLCC nozzle QUICK NK3137 25×25 mm for PLCC-44 and J-lead packages.
Large QFP nozzle QUICK NK3203 35×35 mm for LQFP-176 and large FPGAs.
QFP nozzle QUICK NK3265 32×32 mm for LQFP-144 STM32H7 and SoCs.
Largest QFP nozzle QUICK NK3215 42.5×42.5 mm for LQFP-208 and large FPGAs.
Large QFP nozzle QUICK NK3264 40×40 mm for PQFP-208 and LQFP-200.
QUICK 861DW hot air station 600 W with digital display.
QUICK TR1100 hot air repair station 650 W for SMD repairs.
Professional QUICK 861PRO hot air station 700 W for SMD rework.
Powerful QUICK TR1300 hot air rework system 1000 W for demanding use.
Powerful QUICK 855PG hot air rework system 1200 W for industrial use.
