Repairing BGA circuits

BGA repairs are among the most demanding tasks in electronics service. The solder balls are hidden under the component and can only be worked safely with precise temperature control.

What is a BGA package?

BGA (Ball Grid Array) is a package whose connections form a grid of solder balls on the underside – not visible and not directly accessible.

Where is BGA used?

In processors, graphics chips, memory and controller chips – wherever many connections are needed in a small space.

Most common BGA faults

Cold or cracked solder balls from thermal stress, mechanical strain or ageing.

How does a BGA repair work?

Preheat the board, heat to a temperature profile, lift the chip, clean the pads and place it with precise alignment – best with a rework station.

What is reballing?

Applying new solder balls to the chip using a stencil – needed when the original chip is reused.

What equipment is needed?

A BGA rework system with preheating, stencils, flux and a microscope. Browse the range under soldering equipment.

Common mistakes

The wrong temperature profile, overheating and poor alignment. More in the most common soldering mistakes.

Conclusion

BGA repairs demand experience, preheating and precise profiles. Simpler cases are covered by SMD repairs; find more guides in the ESD Guide.