Soldering Stations JBC, Weller, QUICK, Page 17

911G-32N12H33-01 tip – special N12 H33 geometry for custom robotic applications.

911G-40DV1 tip – widest standard 4.0 mm chisel for power connectors and heat sinks.

Analog soldering station QUICK 969A+, 50 W, 200–480 °C. Suitable for training and hobby.

Digital soldering station QUICK 969B+, 60 W, 200–480 °C. Precise temperature control.

Round QUICK A1121 hot air nozzle with 6.4 mm diameter for SMD desoldering.

Square QUICK A1125 hot air nozzle 10×10 mm for SOIC-8, SOT-23 and small SMD ICs.

Square QUICK A1182 hot air nozzle 24×24 mm for QFP-44, PLCC-28 and mid-size ICs.

QUICK A1191 hot air nozzle 25L (L-shaped) for PLCC-44 and J-lead packages.

Rectangular QUICK A1258 hot air nozzle 7.6×12.7 mm for SOP-8 and SO-16 ICs.

Large round QUICK A1301 hot air nozzle 12.7 mm for through-hole and large SMD.

Single-axis soldering semi-robot QUICK ET9181 for precise manual applications. 911G/911B tips.

Round QUICK NK1120 hot air nozzle 4 mm. Spot heating of SMD components.

Ultra-precise round QUICK NK1124 nozzle 2.5 mm for fine-pitch spot heating.

Round QUICK NK1130 hot air nozzle 4.4 mm for SOT-23 and small SMD transistors.

Round QUICK NK2064 hot air nozzle 6.4 mm for SOIC-8 and lead groups.

Round QUICK NK2084 hot air nozzle 8.4 mm for SOIC-16 and larger SMD ICs.

BGA QUICK NK2280 hot air nozzle 24×24 mm for desoldering 24×24 mm BGA chips.

Shaped QUICK NK3126 QFP nozzle 14×14 mm for LQFP-48 and TQFP-44 MCUs.

Shaped QUICK NK3127 QFP nozzle 17.5×17.5 mm for LQFP-64 with 0.5 mm pitch.

Shaped QUICK NK3129 QFP nozzle 28×28 mm for LQFP-100/128 and large FPGAs.

Special QFP nozzle QUICK NK3132 for non-standard package size.

Rectangular QUICK NK3134 SOP nozzle 7.5×19 mm for SOIC-16 and SOP-20 narrow.

PLCC nozzle QUICK NK3137 25×25 mm for PLCC-44 and J-lead packages.

Smaller PLCC nozzle QUICK NK3140 11.5×11.5 mm for PLCC-20 and PLCC-28.

BQFP nozzle QUICK NK3180 17×17 mm for BQFP packages with protection bumpers.

BQFP nozzle QUICK NK3182 24×24 mm for larger BQFP-160 and BQFP-208.

SOJ nozzle QUICK NK3184 18×8 mm for SOJ memories (DRAM, SRAM) 300mil.

TSOJ nozzle QUICK NK3186 18×10 mm for TSOJ memories with extended body.

SIP nozzle QUICK NK3191 25L for SIP packages with single J-lead row.

Large QFP nozzle QUICK NK3203 35×35 mm for LQFP-176 and large FPGAs.

SOJ nozzle QUICK NK3214 10×26 mm for long SOJ EDO DRAM and FPM DRAM.

Largest QFP nozzle QUICK NK3215 42.5×42.5 mm for LQFP-208 and large FPGAs.

SOP nozzle QUICK NK3257 11×21 mm for SOIC-20 wide-body and SOP-24.

Compact QUICK NK3258 nozzle 7.6×12.7 mm for narrow-body SOIC-8 and SO-8.

SOIC nozzle QUICK NK3259 13×28 mm for 28-lead SOIC and SOP wide-body.

SOIC nozzle QUICK NK3260 8.6×18 mm for 16-lead SOIC-16 (narrow body).

QFP nozzle QUICK NK3261 20×20 mm for LQFP-80 and QFP-80 ARM MCUs.

Small QFP nozzle QUICK NK3262 12×12 mm for LQFP-32 and compact TQFP-44.

Large QFP nozzle QUICK NK3264 40×40 mm for PQFP-208 and LQFP-200.

QFP nozzle QUICK NK3265 32×32 mm for LQFP-144 STM32H7 and SoCs.

QUICK NK850 adapter for older NK nozzles on newer hot air handles.

QUICK TR1100 hot air repair station 650 W for SMD repairs.

Powerful QUICK TR1300 hot air rework system 1000 W for demanding use.

Cordless soldering iron QUICK TS1 with Li-Ion battery. Fast charging, TSS01 tip series.

Soldering station QUICK TS11, 90 W. Compact TSS11 tips with integrated heating element.

Soldering station QUICK TS1100, 65 W. Compact TSS02 tips with integrated heating element.

Soldering station QUICK TS1200, 90 W. Compact TSS02 tips with integrated heating element.

Soldering station QUICK TS2200, 2× 90 W. Two independent irons with TSS02 tips.

Soldering station QUICK TS2300, 2× 150 W induction heating. Two independent irons with TSS02 tips.

TSS02-1.6H-01 tip – bent 1.6 mm chisel for angled soldering (J-lead, PLCC).